FOUP

FOUP

Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport.

  • Industry-proven door provides equipment interoperability and long life
  • Integral wafer supports give excellent wafer plane performance and reliable wafer access
  • ESD shell option provides added wafer protection
  • Advanced purge options are available including front/rear purge and a purge diffuser that provides maximum gas dispersion
  • Optimized hydrophobic materials provide wafer contact and microenvironment control

 

APPLICATIONS

‚ÄčSpectra™ FOUPs Applications

  • FOUP platform that provides clean and secure 300 mm transport and handling
  • Automation compatibility provides low cost of ownerhip

 

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Technical Specifications

SPECIFICATIONS

Product Specifications

DimensionsWidth416 mm (16.4")
 Depth333 mm (13.1")
 Height335 mm (13.2")
WeightEmpty4.2 kg (9.26 lb)
 With wafers7.3 kg (16.09 lb)
Wafer spacing10 mm (0.39") 
Capacity26 wafers 

MATERIALS OF CONSTRUCTION

  • Ultrapure polycarbonate or barrier material used in the FOUP shell, door housing, and door panels
  • Carbon-filled PEEK or high-temperature barrier material (XT EBM) used in wafer contact areas in the shell, door housing, and door components
  • Thermoplastic elastomer material used in the critical door seal
  • Entegris moisture barrier material (EBM) available to enable leading-edge wafer processing technology

CONFIGURATION OPTIONS AND ACCESSORIES

Shell and Door Color Options

  • Amber, red, green, clear, and black (ESD shell only)

Purge Options

  • Front/rear standard purge
  • Rear advanced diffuser

Segregation Options

  • Info pads configurable by customer

Identification Options

  • Bar code and alphanumeric character labels
  • Color handle inserts
  • Cardholders
  • RFID tags with read/write capability

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