Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport.

  • Industry-proven door provides equipment interoperability and long life
  • Integral wafer supports give excellent wafer plane performance and reliable wafer access
  • ESD shell option provides added wafer protection
  • Advanced purge options are available including front/rear purge and a purge diffuser that provides maximum gas dispersion
  • Optimized hydrophobic materials provide wafer contact and microenvironment control



‚ÄčSpectra™ FOUPs Applications

  • FOUP platform that provides clean and secure 300 mm transport and handling
  • Automation compatibility provides low cost of ownerhip


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Technical Specifications


Product Specifications

DimensionsWidth416 mm (16.4")
 Depth333 mm (13.1")
 Height335 mm (13.2")
WeightEmpty4.2 kg (9.26 lb)
 With wafers7.3 kg (16.09 lb)
Wafer spacing10 mm (0.39") 
Capacity26 wafers 


  • Ultrapure polycarbonate or barrier material used in the FOUP shell, door housing, and door panels
  • Carbon-filled PEEK or high-temperature barrier material (XT EBM) used in wafer contact areas in the shell, door housing, and door components
  • Thermoplastic elastomer material used in the critical door seal
  • Entegris moisture barrier material (EBM) available to enable leading-edge wafer processing technology


Shell and Door Color Options

  • Amber, red, green, clear, and black (ESD shell only)

Purge Options

  • Front/rear standard purge
  • Rear advanced diffuser

Segregation Options

  • Info pads configurable by customer

Identification Options

  • Bar code and alphanumeric character labels
  • Color handle inserts
  • Cardholders
  • RFID tags with read/write capability

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