FOUP
Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport.
- Industry-proven door provides equipment interoperability and long life
- Integral wafer supports give excellent wafer plane performance and reliable wafer access
- ESD shell option provides added wafer protection
- Advanced purge options are available including front/rear purge and a purge diffuser that provides maximum gas dispersion
- Optimized hydrophobic materials provide wafer contact and microenvironment control
APPLICATIONS
Spectra™ FOUPs Applications
- FOUP platform that provides clean and secure 300 mm transport and handling
- Automation compatibility provides low cost of ownerhip
Technical Specifications
SPECIFICATIONS
Product Specifications
| Dimensions | Width | 416 mm (16.4") |
| Depth | 333 mm (13.1") | |
| Height | 335 mm (13.2") | |
| Weight | Empty | 4.2 kg (9.26 lb) |
| With wafers | 7.3 kg (16.09 lb) | |
| Wafer spacing | 10 mm (0.39") | |
| Capacity | 26 wafers |
MATERIALS OF CONSTRUCTION
- Ultrapure polycarbonate or barrier material used in the FOUP shell, door housing, and door panels
- Carbon-filled PEEK or high-temperature barrier material (XT EBM) used in wafer contact areas in the shell, door housing, and door components
- Thermoplastic elastomer material used in the critical door seal
- Entegris moisture barrier material (EBM) available to enable leading-edge wafer processing technology
CONFIGURATION OPTIONS AND ACCESSORIES
Shell and Door Color Options
- Amber, red, green, clear, and black (ESD shell only)
Purge Options
- Front/rear standard purge
- Rear advanced diffuser
Segregation Options
- Info pads configurable by customer
Identification Options
- Bar code and alphanumeric character labels
- Color handle inserts
- Cardholders
- RFID tags with read/write capability